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News: CreepImage at the BINDT 2013

Date Added: 04-SEP-13

CreepImage to be showcased at the BINDT Materials Testing 2013 Conference (10-12 September 2013, The International Centre, Telford, UK).

Further information on the CreepImage project will be available throughout the Materials Testing 2013 Conference (10-12 September 2013, The International Centre, Telford, UK) on the TWI exhibition stand. Click here to visit the conference website

Project Partners:
TWI Aimen Dantec Dynamics Innora Integrity NDT Pro Optica